Cooler Master Thermal Pad - 1.0mm MPZ-D002-AFAP-BEU Convenient top-mounted I/O panel:USB3

Convenient top-mounted I/O panel:USB3

office used

The vented top panel exhausts hot air to support two 120mm fans or one 240mm radiator

Turing GPU Architecture Based on state-of-the-art 12nm FFN (FinFET NVIDIA) high-performance manufacturing process customized for NVIDIA to incorporate 896 CUDA cores

and prolongs hardware lifespan

Cooler Master Thermal Pad - 1.0mm MPZ-D002-AFAP-BEU Convenient top-mounted I/O panel:USB3Cooler Masters new Thermal formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13. 3w mK for rapid cooling. The non toxic, non corrosive, and electrically insulating properties make it safe and simple for application without the worry of hardening or solidifying. The double sided adhesive provides seamless contact between surfaces. Dimensions: 95 x 45 mm Conductivity: 13. 3 (W m. K) Formulated with Nano Particles